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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Toward High Throughput Backend Provision for Mobile Apps with a Microservice Approach
Details
Toward High Throughput Backend Provision for Mobile Apps with a Microservice Approach
Journal
International Conferance on Internet Computing and Internet of Things
Date Issued
2017
Author(s)
He-Ming Ruan
Jen-Hao Kuo
Chun-Yi Chan
Chin-Laung Lei
CHIN-LAUNG LEI
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/429790
Type
conference paper
