Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

Resource

Journal of Electronic Materials 31 (5): 494-499

Journal

Journal of Electronic Materials

Journal Volume

31

Journal Issue

5

Pages

494-499

Date Issued

2002

Date

2002

Author(s)

Chiu, M. Y.

Wang, S. S.

Chuang, T. H.

URI

Type

journal article

File(s)

Name

71.pdf

Size

474.41 KB

Format

Adobe PDF

Checksum

(MD5):4dde3bbd18592aac9d7237d1913785bc