Corrosion and ion migration of Ag-alloy bonding wires with various Pd and Au contents
Journal
EUROCORR 2017 - The Annual Congress of the European Federation of Corrosion, 20th International Corrosion Congress and Process Safety Congress 2017
Date Issued
2017
Author(s)
Abstract
The corrosion behaviors of Ag-alloy bonding wires with various Pd and Au contents in 3.5 wt% NaCl solution were investigated, and the results were compared with those of pure Ag wire. The results revealed that the corrosion potential for all bonding wires declined with the increase of Pd contents, indicating the decrease of the thermodynamics corrosion tendency. However, the corrosion current density of Ag-alloy wires decreased with increasing Pd content: Ag-6Pd~Ag-4.5Pd
Subjects
Binary alloys; Corrosion prevention; Corrosion rate; Corrosion resistance; Corrosion resistant alloys; Corrosive effects; Electronics packaging; Ions; Palladium; Silicones; Sodium alloys; Sodium chloride; Solutions; Ternary alloys; Thermodynamics; Wire; 3.5 wt% NaCl solution; Bonding wires; Corrosion current densities; Corrosion potentials; Electronic Packaging; Encapsulation process; Ion migration; NaCl aqueous solution; Silver alloys
Type
conference paper