ESPRIT: A Compact Reluctance Based Interconnect Model Considering Lossy Substrate Eddy Current
Journal
International Microwave Symposium (IMS)
Date Issued
2004-06
Author(s)
Rong Jiang
Abstract
With the advancement of radio frequency mixed signal ICs, lossy silicon substrate has significant impact on the already complicated interconnect niodeling issue. To account for the substrate loss, the traditional electromagnetic methods are often computationally prohibitive for large scale systems.
Type
conference paper