Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages

Resource

Soldering and Surface Mount Technology,14(3),25-29.

Journal

Soldering and Surface Mount Technology

Journal Volume

14

Journal Issue

3

Pages

25-29

Date Issued

2002-03

Date

2002-03

Author(s)

Shiau, L. C.

Ho, C. E.

Kao, and C. R.

URI

http://ntur.lib.ntu.edu.tw//handle/246246/198844

Type

journal article