Rapid Resin Mold with Embedded Thin Film Pressure/Temperature Sensors

Journal

The 25th Annual Conference of the IEEE Industrial Electronics Society. (IECON 1999)

Pages

1301 -1306

Date Issued

1999-11

Author(s)

C. E. Lin

C. M. Chen

Y. S. Chen

DOI

URI

SDGs

[SDGs]SDG7

Type

conference paper