Rapid Resin Mold with Embedded Thin Film Pressure/Temperature Sensors
Journal
The 25th Annual Conference of the IEEE Industrial Electronics Society. (IECON 1999)
Pages
1301 -1306
Date Issued
1999-11
Author(s)
Abstract
In this paper we have developed a new approach by embedding sensors into rapid resin mold's core and cavity for directly measuring the pressure and temperature information for the purpose of improving the injection molding process. Using the information collected by embedded piezoelectric sensors, we can develop an on-line, close-loop control system to ensure the quality of products. We have simulated the system with time versus temperature for different mold materials.
SDGs
Type
conference paper