Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler

Resource

Journal of Electronic Materials 36 (9): 1193-1198

Journal

Journal of Electronic Materials

Journal Volume

36

Journal Issue

9

Pages

1193-1198

Date Issued

2007

Date

2007

Author(s)

Chang, S.Y.

Chuang, T.H.

Yang, C.L.

URI

Type

journal article

File(s)

Name

105.pdf

Size

352.98 KB

Format

Adobe PDF

Checksum

(MD5):8c205e270b40d0099e74f4a5141ea3be