SPECIAL ISSUE ON LEAD-FREE SOLDERS AND PROCESSING ISSUES IN MICROELECTRONIC PACKAGING
Resource
Journal of Electronic Materials,32(12),1359-1359.
Journal
Journal of Electronic Materials
Journal Volume
32
Journal Issue
12
Pages
1359-1359
Date Issued
2003-12
Date
2003-12
Author(s)
Lucas, J. P.
Chada, S.
Kang, S. K.
Kao, C. R.
Lin, K. L.
Ready, J.
Yu, and J.
Type
journal article