Residual Stresses in Meta/Ceramic Bonded Strips

Residual stresses that develop during cooling of a metal/ ceramic strip are calculated analytically. It is shown that the metal may behave elastically or plastically (with full or partial plasticity) depending on the mechanical properties, the thickness of the two constituents, and the mismatch in thermal expansion. Residual stresses are also calculated for a sequence consisting of constrained undercooling, removal of the constraint, and reheating. It is demonstrated that reheating, which results in elastic stress relaxation, may be used to eliminate the residual stress. The optimum undercooling and reheating conditions needed to produce a stress?free strip, at the operational temperature, are calculated, and specific results are presented for the system Cu/A2, O2. Copyright ? 1985, Wiley Blackwell. All rights reserved