Sintering behavior and interfacial analysis of Ni/Cu electrode with BaTiO3 particulates

Journal

Journal of Electroceramics

Journal Volume

14

Journal Issue

1

Pages

25-36

Date Issued

2005

Author(s)

Chen, C.-L.

Lee, W.-H.

Wei, W.-C.

WEN-CHENG J. WEI

DOI

10.1007/s10832-005-6581-5

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492343

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-15544371956&doi=10.1007%2fs10832-005-6581-5&partnerID=40&md5=3dee1b9eecfac9e18db21349e9581bcb

SDGs

[SDGs]SDG7

Type

journal article