Scalable slot-die coating of dipole-engineered self-assembled monolayers for efficient large-area perovskite photovoltaics
Journal
Surfaces and Interfaces
Journal Volume
96
Start Page
109929
ISSN
24680230
Date Issued
2026-09-01
Author(s)
Li, Chia-Feng
Huang, Shih-Han
Huang, Sheng-Wen
Chen, You-Ren
Cha, Hou-Chin
Chao, Pin-Hao
Huang, Yu-Ching
Abstract
Self-assembled monolayers (SAMs) are increasingly employed as ultrathin functional coatings for regulating surface energetics in advanced thin-film technologies. However, achieving simultaneous control over molecular ordering, interfacial robustness, and film uniformity remains a critical challenge, particularly when transitioning from lab-scale processes to scalable slot-die coating. In this work, we systematically investigate the role of small carboxylic acid additives in regulating the coating quality and electronic structure of MeO-2PACz monolayers. By introducing acetic acid (AcOH) and trifluoroacetic acid (TFA) as surface modulators, we elucidate how subtle chemical variations govern nanoscale packing behavior and work-function tuning. The TFA-modified coating exhibits a significantly more ordered molecular arrangement and enhanced surface hydrophobicity (contact angle ∼67.4°), indicating superior film homogeneity. To validate the scalability and coating uniformity, the optimized SAMs were integrated into large-area (5 × 5 cm2) multilayer thin-film modules using a slot-die coating process. Under accelerated thermal–humidity aging conditions, the additive-engineered interfaces demonstrated superior robustness, retaining 65% of their initial function. Furthermore, the optimized slot-die coated modules achieved a power conversion efficiency of 14.72%, confirming that the proposed dipole-engineering strategy effectively translates high coating quality into macroscopic device performance. Overall, this study provides a process-compatible guideline for designing robust, large-area interfacial coatings suitable for scalable manufacturing in advanced thin-film systems.
Subjects
Ambient
Interface
Module
Self-assembled monolayers
Slot-die
Publisher
Elsevier B.V.
Type
journal article