Efficient High-Fidelity Two-Dimensional Warpage Modeling for Advanced Packaging Analysis
Part Of
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
Start Page
1
End Page
9
ISBN (of the container)
979-840071077-3
ISBN
[9798400710773]
Date Issued
2024-10-27
Author(s)
Event(s)
43rd International Conference on Computer-Aided Design, ICCAD 2024
Publisher
ACM
Type
conference paper