High speed wireless inter-chip signal interconnect using vertical coupled inductors for 3D-IC applications
Date Issued
2009
Date
2009
Author(s)
Pan, Chun
Abstract
A wireless interconnect for 3D-IC applications is implemented by using coupled inductor design. Inductive coupling interconnect has longer communication distance asompared with capacitive interconnect. Our communication distance is 15µm. The longer distance means that it can resist the alignment mismatches and increase the yields forackaging. We also use a mis-alignment resistance coupled inductor to alleviate the alignment problem. We use ASK modulation technique to transmit the data. In transmitter,a PLL is used as the local oscillator, and switch is used as a passive mixer. In receiver,rectifiers are used to demodulate received signal, and cascaded limiters amplify the signal.This interconnect has energy efficiency of 4.08pJ/bit at 6Gbps. The proposed wireless interconnect is implemented in TSMC 0.18µm process for demonstration of this architecture.
Subjects
3D IC
SDGs
Type
thesis
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