Active Antenna Subsystem Integration of Steerable Boresight Radiation Beams for 5G Millimeter Wave Applications by System-in-Packaging Process
Journal
Proceedings - Electronic Components and Technology Conference
Journal Volume
2020-June
Pages
629-634
Date Issued
2020
Author(s)
Shen, P.-Z.
Lin, D.-B.
Lin, Z.-H.
Wu, K.-H.
Fang, L.-C.
Yang, C.-S.
Chou, C.-W.
Pan, C.-L.
Lin, C.-T.
Lin, J.-C.
Abstract
In this paper, an active antenna-in-package (AiP) design at millimeter wave frequencies (mmW) is presented for user equipment (UE) and customer-premises equipment (CPE) applications. In particular, the UE and CPE AiP implements 4 × 4 and 6 × 6 microstrip antenna elements on the stacked substrates of conventional system-in-package process to realize the desired gains for 5G applications. Within a 19 × 19 mm2 area, we are able to achieve -10 dB reflection coefficient bands of 24.25-29.5 and 37-43.5 GHz by simulations for the two most popular 5G frequency bands, where the simulated gains are 13.7 and 15.22 dBi, respectively. The beam scan range is up to ±40o. On the other hand, the CPE AiP is designed on a 33 × 33 mm2 area, where the maximum gains are 18.83 and 21.25dBi at 28 and 39 GHz, respectively. © 2020 IEEE.
Subjects
Active antenna subsystem; antenna in package; microstrip patch antenna; millimeter-wave frequencies; system in package
Other Subjects
Antenna radiation; Microstrip antennas; Microwave antennas; Millimeter waves; Network components; Steerable antennas; System-in-package; Active antennas; Conventional systems; Customer premises equipment; G-frequency band; Millimeter wave frequencies; Millimeter-wave applications; System-in-packaging; User equipments; 5G mobile communication systems
Type
conference paper