A low-cost DC-to-92 GHz broadband three-path bondwire interconnect
Journal
2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
Pages
34-36
Date Issued
2015
Author(s)
Abstract
This paper presents a low-cost and broadband bondwire interconnect for chip-to-chip and chip-to-carrier communications. Four transmission lines and three signal bondwires form a three-path interconnect structure which can greatly reduce the bondwire effect. Ground bondwires are also carefully deployed to have good ground connection between chips or chip and carrier. An interconnect from a 0.18-μm CMOS chip to a Glass-Integrated-Passive-Device (GIPD) carrier is designed to verify the idea. Measured results of three samples show that the insertion loss and return loss can be better than 3 dB and 11.2 dB from DC up to 92 GHz. © 2015 IEEE.
Subjects
Bondwire; Broadband; Chip-to-chip and chip-to-carrier communications; Low-cost
SDGs
Other Subjects
Carrier communication; Costs; Radio waves; Bondwire; Broadband; Chip to chips; Ground connections; Integrated passive device; Interconnect structures; Low costs; Measured results; Integrated circuit interconnects
Type
conference paper