Characterization of thin films and intermetallic compounds in solder joint

Journal
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Journal Volume
2005
Pages
703-705
Date Issued
2005
Author(s)
Tsai, I.
Tai, L.J.
Yen, S.F.
Chuang, T.H.
Lo, R.
Ku, T.
Wu, E.
DOI
URI
URL
Type
conference paper

臺大位居世界頂尖大學之列，為永久珍藏及向國際展現本校豐碩的研究成果及學術能量，圖書館整合機構典藏（NTUR）與學術庫（AH）不同功能平台，成為臺大學術典藏NTU scholars。期能整合研究能量、促進交流合作、保存學術產出、推廣研究成果。

To permanently archive and promote researcher profiles and scholarly works, Library integrates the services of “NTU Repository” with “Academic Hub” to form NTU Scholars.

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開放取用是從使用者角度提升資訊取用性的社會運動，應用在學術研究上是透過將研究著作公開供使用者自由取閱，以促進學術傳播及因應期刊訂購費用逐年攀升。同時可加速研究發展、提升研究影響力，NTU Scholars即為本校的開放取用典藏（OA Archive）平台。（點選深入了解OA）

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