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  4. Analyses of mode I edge delamination by thermal stresses in multilayer systems
 
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Analyses of mode I edge delamination by thermal stresses in multilayer systems

Journal
Composites Part B: Engineering
Journal Volume
37
Journal Issue
1
Pages
1-9
Date Issued
2006
Author(s)
Hsueh C.-H.
Lee S.
Lin H.-Y.
CHUN-HWAY HSUEH  
DOI
10.1016/j.compositesb.2005.05.005
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/424851
URL
https://www2.scopus.com/inward/record.uri?eid=2-s2.0-24344474373&doi=10.1016%2fj.compositesb.2005.05.005&partnerID=40&md5=c1520fe19e8b057197208f487e73e6a1
Abstract
Multilayer systems are generally subjected to thermal stresses because of the thermal mismatch between layers, and localized stresses normal to interfaces; i.e., interfacial peeling stresses, exist at edges because of the free-edge effect. These peeling stresses can result in mode I edge delamination. However, because of the complexity of the problem, exact closed-form solutions for peeling stresses are unattainable, even for bilayer systems. As a result, the peeling moment resulting from these localized peeling stresses was proposed recently as an alternative to study edge delamination. Exact closed-form solutions for the peeling moment at each interface in multilayer systems are derived in the present study, and approximate solutions for the special case of multilayer of thin films on a thick substrate are also presented. Specific results are calculated for GaAs/Si bilayers and GaP/GaAs0.5P 0.5/GaAs trilayers. However, the present solutions are readily to be applied to any elastic multilayer system for characterizing mode I edge delamination by thermal stresses. ? 2005 Elsevier Ltd. All rights reserved.
Subjects
A. Layered structures
B. Delamination
B. Residual stress
C. Analytical modelling
Type
journal article

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