Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

2

Pages

310-318

Date Issued

2006

Author(s)

Chuang, T.-H.

Yen, S.-F.

Wu, H.-M.

TUNG-HAN CHUANG

DOI

10.1007/BF02692451

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492009

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33644924058&doi=10.1007%2fBF02692451&partnerID=40&md5=9fe5261799efaf25dc7a30e66fb2fe9c

Type

conference paper