Placement of shorting vias for power integrity in multi-layered structures
Journal
IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging
Pages
91-94
Date Issued
2008-10
Author(s)
Abstract
The effect of the number of the shorting vias on the power integrity of multi-layered structures has been demonstrated in this paper. Following that, an empirical design rule for the fewest number of the shorting vias is proposed to maintain the original power integrity and reduce the cost at the same time. For validation, the design concept is also realized in a real package structure at last.
Type
conference paper