Placement of shorting vias for power integrity in multi-layered structures

Journal

IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging

Pages

91-94

Date Issued

2008-10

Author(s)

S.-H. Hsu

Y.-S. Cheng

W.-D. Guo

H.-H. Cheng

C.-C. Wang

DOI

10.1109/EPEP.2008.4675885

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/342490

Type

conference paper