銅散熱元件之MIM製程及散熱性質研究
Date Issued
2005
Date
2005
Author(s)
陳柏源
DOI
zh-TW
Abstract
The trend of the processor performance is higher power and thus heat dissipation increases significantly every year. As heat dissipation increases, the current trend of the electronic packages is to make smaller, lighter, and thinner devices. The thermal management has become more and more challenging as new electronic devices become more compact but without sacrificing their performances. Fortunately, the heatsink provided high surface area, geometrical pattern and maturity technology, and the heat pipe provide excellent heat transfer capability in cooling technology. In this research, the heatsink and heat pipe were combined to form the vapor chamber using the metal injection molding (MIM) process, and its heat dissipate performance was evaluated.
The results of this study were divided into three sections. The first part was to find processing parameters that can increase the number and the aspect ratio of fins. The result of the first part show that the holding pressure plays an important role. After sintering, the densities of the fin and the bottom plate are both about 96%. The thermal resistance is 1.156℃/W, and the power dissipation is 40W when the junction temperature is 70℃. In the second part, the efficiencies of wick and working fluid were evaluated. The optimum condition is Powder-Mesh wick with all pores filled with water. The thermal resistance is 1.046℃/W, and the power dissipation is 42W when the junction temperature is 70℃. Finally, the processing parameters to improve the property of MIM’s specimen were studied. The results show that cold isostatic pressing process (CIP) can improve the relative density by about 1%. Increasing PE content can reduce the injection resistance in the spiral flow test. The hardness could be increased by adding W, Mo, Ag and Fe3P respectively. On the electric conductivity, specimen of MIM process is inferior to the traditional powder metallurgy process.
Keywords：Metal Injection Molding(MIM), Copper Powders, Heatsink, Vapor Chamber, Heat Dissipation.
Subjects
金屬粉末射出成形
銅粉
散熱片
平板式熱導管
Metal Injection Molding(MIM)
Copper Powders
Heatsink
Vapor Chamber
Heat Dissipation
Type
thesis
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