Interfacial reaction issues for lead-free electronic solders

Resource

Journal of Materials Science: Materials in Electronics 18 (1-3): 155-174

Journal

Journal of Materials Science: Materials in Electronics

Journal Issue

18

Pages

155-174

Date Issued

2007

Date

2007

Author(s)

Ho, C. E.

Yang, S. C.

Kao, C. R.

URI

Type

journal article

File(s)

Name

05.pdf

Size

1.55 MB

Format

Adobe PDF

Checksum

(MD5):8d2138dffb76663e77d92f90367d97fc