Nickel-tin solid-liquid inter-diffusion bonding
Journal
International Journal of Precision Engineering and Manufacturing
Journal Volume
15
Journal Issue
1
Pages
143-147
Date Issued
2014
Author(s)
Abstract
This paper presents a solid liquid inter-diffusion (SLID) bonding process using nickel-tin. By using two metals with different melting points, Ni3Sn4, an intermetallic compound (IMC) at 523K was formed. Unlike pure metal, the IMC can be used in high temperature applications of up to 800K without failure. The formation energy of Ni3Sn4 IMC was calculated to be 23.15 kJ/mol from the experimental result. Compared to the traditional soldering technique, a higher temperature resistance bonding joint can be achieved using the nickel-tin SLID bonding technique. © 2014 Korean Society for Precision Engineering and Springer-Verlag Berlin Heidelberg.
SDGs
Type
journal article