Key Effects and Process Parameters Extraction on the CD of Reactive Ion Etching (RIE) Based on DOE Modeling

Journal

IEEE Transactions on Semiconductor Manufacturing

Journal Volume

30

Journal Issue

4

Pages

539-546

Date Issued

2017

Author(s)

Rizquez, M.

Roussy, A.

Blue, J.

Bucelle, L.

Pinaton, J.

Pasquet, J.

DOI

10.1109/TSM.2017.2758020

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/467301

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85030783822&doi=10.1109%2fTSM.2017.2758020&partnerID=40&md5=9450d07c12218840bc152298e17da060

Type

journal article