Thermal and dielectric properties enhancement of photocurable acrylate polymers for digital light processing 3D printed electronics
Journal
Journal of Applied Polymer Science
Date Issued
2021
Author(s)
Abstract
Digital light processing 3D printing has been rapidly evolving conventional manufacturing industry with the most meticulous resolution and strongest layer-to-layer adhesion among all additive manufacturing techniques. In this study, to improve poor polymer thermal stability and dielectric properties from prevailing methyl methacrylate-based resin, tri-functional trimethylolpropane tri-acrylate (TMPTA) is introduced to form a stable polymer network. Meanwhile, monomers carrying non-polar, bulky adamantane are added to eradicate poly-TMPTA's notorious high cracking and warping tendency. Test results showed both high 1-adamantyl methacrylate and 1, 3-adamantyl di-acrylate (ADDA) additions can print crack-free samples. However, only ADDA addition keeps low CTE (82.86 ppm/oC, 200 ~ 260°C) and cuts down Df (0.02, 10 GHz). TMPTA polymer network modifications of both additions are explored. By contrast, poly-MMA exhibits much higher CTE (323.44 ppm/oC) and Df (0.035). A 3D-printed curvilinear circuit board from above resin formulation with electroplated copper circuits successfully passes lead-free level reflow without deformation. ? 2021 Wiley Periodicals LLC.
Subjects
blends
dielectric properties
manufacturing
photopolymerization
thermal properties
3D printers
Acrylic monomers
Esters
Photopolymerization
Resins
Acrylate polymers
Blend
Dielectrics property
Digital light processing
Photo polymerization
Photocurable
Polymer networks
Printed electronics
Thermal and dielectric properties
Trimethylolpropane
Dielectric properties
SDGs
Type
journal article