Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions

Resource

Journal of Electronic Materials 33 (4): 374-381

Journal

Journal of Electronic Materials

Journal Volume

33

Journal Issue

4

Pages

374-381

Date Issued

2004

Date

2004

Author(s)

Chuang, T. H.

Huang, K. W.

Lin, W. H.

URI

Type

journal article

File(s)

Name

88.pdf

Size

2.08 MB

Format

Adobe PDF

Checksum

(MD5):0f4ce049c5690bd2e8ec28341296d4df