Use of a Ni interlayer to improve the thermal cycling reliability of Cu/sapphire bilayers
Journal
International Journal of Applied Ceramic Technology
Journal Volume
12
Journal Issue
3
Pages
685-692
Date Issued
2015
Author(s)
Abstract
The thermal cycling reliability of ceramic/metal laminates is critical for their applications in microelectronic modules. A eutectic bonding process is used to prepare copper/sapphire bilayers in this study. Due to elastic and thermal mismatches between alumina and copper, the Cu/sapphire bilayer cannot pass a thermal cycling test. The thermal cycling reliability can be improved through the use of a metallic nickel interlayer. During the bonding process, the nickel interlayer was oxidized first, reacted with alumina to form a NiAl 2 O 4 spinel phase. The thermal diffusivity of the bilayer with spinel interphase remains high after the temperature cycling test.
Type
journal article