Use of a Ni interlayer to improve the thermal cycling reliability of Cu/sapphire bilayers

Journal

International Journal of Applied Ceramic Technology

Journal Volume

12

Journal Issue

3

Pages

685-692

Date Issued

2015

Author(s)

Lee, S.-K.

Tuan, W.-H.

Yang, T.-J.

DOI

10.1111/ijac.12247

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492164

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84928356087&doi=10.1111%2fijac.12247&partnerID=40&md5=550dd8b8fee73dd929db9777802a0ed1

Type

journal article