Electromigration failure in flip chip solder joints due to rapid dissolution of copper
Resource
Journal of Materials Research,18(11),2544-2548.
Journal
Journal of Materials Research
Journal Volume
18
Journal Issue
11
Pages
2544-2548
Date Issued
2003-11
Date
2003-11
Author(s)
Hu, Y. C.
Lin, Y. H.
Kao, C. R.
Tu, K. N.
Type
journal article