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  4. High thermal conductive Graphene-based Composites and its Controllable ESD Application on Device Packaging
 
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High thermal conductive Graphene-based Composites and its Controllable ESD Application on Device Packaging

Journal
Electrical Overstress/Electrostatic Discharge Symposium Proceedings
Journal Volume
2023-October
ISBN
9781585373475
Date Issued
2023-01-01
Author(s)
Lin, Rong Teng
Wu, Bi Xian
Yang, Yun Hong
Hsu, Teng Chin
Chao, Chia Lien
Chang, Yu Chiao
Su, Chiao Jung
Lee, Jam Wem
Chen, Kuo Ji
Lin, Wun Jie
CHIEN-HAO LIU
TZU-HSUAN CHANG  
DOI
10.23919/EOS/ESD58195.2023.10287747
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/638127
URL
https://api.elsevier.com/content/abstract/scopus_id/85179007836
Abstract
A novel ESD protection technique was achieved through renovating packaging material with uniformly dispersed graphene nanosheets. The ESD protection ability of the composite can be self-activated in nanoseconds with a manageable threshold within a few volts. The application of 2D reinforced packaging material demonstrates that high thermal conductivity, good EMI protection capability, as well as ESD protection can be achieved simultaneously.
Type
conference paper

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To permanently archive and promote researcher profiles and scholarly works, Library integrates the services of “NTU Repository” with “Academic Hub” to form NTU Scholars.

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