A compact analytic model of the strain field induced by through silicon vias
Journal
IEEE Transactions on Electron Devices
Journal Volume
59
Journal Issue
3
Pages
777-782
Date Issued
2012
Author(s)
Jan, S.-R.
Chou, T.-P.
Yeh, C.-Y.
Liu, C.W.
Goldstein, R.V.
Gorodtsov, V.A.
Shushpannikov, P.S.
Type
journal article