Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering

Resource

Journal of Electronic Materials,28(11),1231-1238.

Journal

Journal of Electronic Materials

Journal Volume

28

Journal Issue

11

Pages

1231-1238

Date Issued

1999-11

Date

1999-11

Author(s)

Ho, C. E.

Chen, Y. M.

Kao, and C. R.

URI

http://ntur.lib.ntu.edu.tw//handle/246246/198886

Type

journal article