The Application and Reliability of Solid-Liquid Interdiffusion Bonding Technology in 3D IC Packages
Date Issued
2015
Date
2015
Author(s)
Chang, Jing-Yao
Abstract
Due to electronic products trend towards light, thin, short, and small, the reliability requirement is more and more higher especially for high power and high density package such as 3D IC, high power module and coreless flip chip package. As the package technology mentioned above, high reliability and characteristic life of metal joint are extremely important. In this paper, we will focus on energy to discuss the rilability of 3D IC package and the board-level reliability of the coreless flip chip package. However, underfill plays as the most important material to enhance the reliability of flip chip package, by reducing the mismatch of coefficient of thermal expansion (CTE) between silicon chip and substrate. To select a compatible underfill material is important because the reliability characteristics of flip chip package were significantly affected by different material properties. Regarding the micro joint technology of 3D IC in this paper, two kinds of underfill were option to evaluate the reliability characteristics of 3D IC flip chip package. A 3D finite element analysis model was established by ANSYS 12.0 software to study the stress / strain contours of the microjoints sealed by various underfill materials under temperature cycling. Moreover, temperature cycling test (TCT) was chosen to evaluate the reliability of the assemblies which were survived after the preconditioning test, and the relationship between the failure rate and the number of cycles. According to the results of simulation and experiments, we choose the compatible underfill material for the following experiments. Two kinds of different microbump structures were used as the test vehicle. The microbumps were with a pitch size of 20
Subjects
Intermetallic
microbump
reliability
underfill
glass transition temperature
coefficient of thermal expansion
Sn depletion zone
solid-liquid interdiffusion
Flip chip package
coreless substrate
failure mode
Type
thesis