Application of Taguchi Method in Wear Analysis of Latching Mechanism For the Wafer Container Door
Date Issued
2009
Date
2009
Author(s)
Lin, Yao-Zhin
Abstract
The purpose of this study is to investigate the wear of the latching mechanism used in the wafer container door. The wafer container provides the wafers a highly clean mini-environment for storage and transporting such that they will not be contaminated during the manufacturing process. This research discusses parameter optimization of the latching mechanism for the wafer container door by Taguchi method based design of experiments to understand how the variation in product specifications affects the system performance. Taguchi method is the robust design that enables the designer to find the optimum combination of control parameters to make the response insensitive to noise factors. The method uses signal to noise ratio and analysis of variance to investigate the contribution of each factor to wear of the latching mechanism for the wafer container door. In the method, eight control factors：curve of guide, radius of roller follower, radius of base circle, cam angle for rise, cam profile for rise, cam profile for return, cam angle for forward dwell, and cam angle for backward dwell are considered. Experimental results demonstrate wear is mainly affected by the factors of radius of base circle and cam profile for rise. The results also show that a distinct improvement over the wear of the latching mechanism can be achieved.
Subjects
wear
latching mechanism
Taguchi method
robust design
signal of noise ratio
analysis of variance
Type
thesis
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