A Study on the Reaction between Cu and Sn-3.5Ag Solder Doped with Small Amounts of Ni
Resource
Journal of Electronic Materials,32(11),1203-1208.
Journal
Journal of Electronic Materials
Journal Volume
32
Journal Issue
11
Pages
1203-1208
Date Issued
2003-11
Date
2003-11
Author(s)
Tsai, J. Y.
Hu, Y. C.
Tsai, C. M.
Kao, and C. R.
Type
journal article