Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems

Journal

Electronic Components and Technology Conference

Pages

1825-1830

ISBN

1424409853

9781424409853

Date Issued

2007

Author(s)

Yang S.C.

DOI

10.1109/ECTC.2007.374045

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-35348866707&doi=10.1109%2fECTC.2007.374045&partnerID=40&md5=6ca4c7b217d1e77ac9d6c47124804524

https://scholars.lib.ntu.edu.tw/handle/123456789/432695

Type

conference paper