A prediction method of heat generation in the silicon substrate for 3-D ICs

Journal

IEEE Conference on Electrical Performance of Electronic Packaging and Systems

Date Issued

2015

Author(s)

Yi-An Hsu

Chi-Hsuan Cheng

Yi-Chang Lu

Tzong-Lin Wu

DOI

10.1109/epeps.2015.7347136

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/429931

SDGs

[SDGs]SDG7

Type

conference paper