A fundamental modeling approach for nano-grinding of silicon wafers

Journal

Materials Science Forum

Journal Volume

505-507

Journal Issue

PART 1

Pages

253-258

Date Issued

2006

Author(s)

Young, H.T.

Huang, H.-Y.

Yang, Y.-J.

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-35348923540&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/322469

Type

book