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College of Engineering / 工學院
Civil Engineering / 土木工程學系
Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Microbump
Details
Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Microbump
Journal
First Computational Mechanics Conference in Taiwan (ACMT 2015)
Date Issued
2015
Author(s)
C-H Yu
C-C Lin
C-S Chen
CHUIN-SHAN CHEN
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/591133
Type
conference paper