The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate

Journal

Microelectronics Reliability

Journal Volume

43

Journal Issue

3

Pages

453-463

Date Issued

2003

Author(s)

Shiue, R.K.

Tsay, L.W.

Lin, C.L.

DOI

10.1016/S0026-2714(02)00259-7

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491909

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0037370335&doi=10.1016%2fS0026-2714%2802%2900259-7&partnerID=40&md5=342369001044cf8d5c029f043fd2d7eb

Type

conference paper