Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Resource

IEEE Transactions on Advanced Packaging,24(4),493-499.

Journal

IEEE Transactions on Advanced Packaging

Journal Volume

24

Journal Issue

4

Pages

493-499

Date Issued

2001-11

Date

2001-11

Author(s)

Ho, C. E.

Tsai, S. Y.

Kao, and C. R.

URI

http://ntur.lib.ntu.edu.tw//handle/246246/198826

Type

journal article