Vector Fitting Method in Transient Thermal Analysis for Heterogeneous Multilayered Packaging
Journal
IEEE Electrical Design of Advanced Packaging and Systems Symposium
Start Page
1
End Page
4
ISSN
21511225
ISBN (of the container)
979-833159659-0
Date Issued
2026-03-03
Author(s)
Abstract
Transient temperature distribution in the multilayered packaging is usually analyzed by the computational fluid dynamics with an intensive time-step in Ansys Icepak to ensure its accuracy yet with a significant computational cost. Without an explicit time-stepping constraint, the frequencydomain vector fitting method to evaluate the transient thermal response is thus proposed to enable an efficient reconstruction of its time-domain behavior in a good agreement with Icepak's.
Event(s)
2025 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2025
Subjects
Fourier transform
heterogeneous multilayered packaging
Laplace transform
transient thermal analysis
vector fitting method
Publisher
IEEE
Type
conference paper