Electromigration induced metal dissolution in flip-chip solder joints

Journal

Pricm 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing, Pts 1-5

Pages

2655-2658

ISBN

978-0-87849-960-1

Date Issued

2005

Author(s)

Lin, Y. H.

Tsai, C. M.

Hu, Y. C.

Lin, Y. L.

Tsai, J. Y.

Kao, C. R.

URI

Type

book chapter