Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations
Resource
Materials Science and Engineering A,396(1-2),385-391.
Journal
Materials Science and Engineering A
Journal Volume
396
Journal Issue
1-2
Pages
385-391
Date Issued
2005-04
Date
2005-04
Author(s)
Luo, W. C.
Ho, C. E.
Tsai, J. Y.
Lin, Y. L.
Kao, and C. R.
Type
journal article