Interfacial reactions in the Sn-In-Zn/Ag and Sn-In-Zn/Ni couples
Journal
Materials Chemistry and Physics
Journal Volume
132
Journal Issue
2-3
Start Page
481
End Page
487
ISSN
02540584
Date Issued
2012
Author(s)
Abstract
Sn-In-Zn alloys are promising Pb-free solders. Their interfacial reactions with Ag and Ni substrates at 230 °C are experimentally determined using reaction couple techniques. The reaction path is liquid/Ag in the Sn-20 wt%In-x wt%Zn/Ag couple when the Zn content is less than 0.7 wt%, and the reaction path changes to liquid/ε-AgZn3/γ-Ag5Zn 8/-AgZn/Ag when the Zn content is 5 wt%Zn. The reaction path is liquid/Ni3Sn4/Ni when the Zn content is less than 1.0 wt%, and the reaction path becomes liquid/γ-Ni5Zn 21/(Ni3Sn4)/Ni when the Zn content is higher than 2.0 wt%. The reaction paths in both two kinds of couples are affected by the Zn addition. © 2011 Elsevier B.V. All rights reserved.
Subjects
Intermetallic compounds
Metals
Phase equilibria
Phase transitions
Publisher
Elsevier Ltd
Type
journal article