防電磁波干擾電子資訊產品外殼之超塑性成型加工技術研究(2/2)
Date Issued
2001
Date
2001
Author(s)
DOI
892622E002011
Abstract
This study focuses on the novel
processing of making electromagnetic
interference (EMI) shielding enclosures
specifically for the portable personal
computers (PC) with typical
requirements of low cost, lightweight,
moderate production rate, fine surface
finishing and EMI shielding
effectiveness in excess of 60 dB. This
subprogram will cooperatively work
with other subprograms and apply the
collective output of the team efforts to
develop a complete package of
processing technologies for the mass
production of portable PC enclosures.
The novel processing utilizes and the
combined superplastic forming /
thermogorming technique
underdeveloped by the subprogram I.
and the combined superplastic
forming/injection molding technique
underdeveloped by the subprogram II.
The thin superplastic forming/theromolding
processing is a low temperature high strain rate Zn-22% Al alloy to be developed and supplied by the subprogram III.
Subjects
Enclosures for portable PC
Zn-Al alloy
Superplastic forming
Thermo-forming
Injection
molding
molding
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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