Reply to 'comment on 'A compact analytic model of the strain field induced by through ilicon vias''
Journal
IEEE Transactions on Electron Devices
Journal Volume
62
Journal Issue
9
Date Issued
2015
Author(s)
Jan, S.-R.
Chou, T.-P.
Yeh, C.-Y.
Liu, C.W.
Goldstein, R.V.
Gorodtsov, V.A.
Shushpannikov, P.S.
Abstract
The comment adds the results of 2 × 2 TSVs which is an extension of our 2-TSV case, and the clarification of no thermal strain effect on mobility. There are no contradictions with our original paper at all. Note that for the mobility calculation, the temperature dependence can be considered by the band parameters and phonon scattering [1].
Type
journal article