Sub-THz and THz CMOS Electronics for Sensing and Communication Applications
Journal
Asia-Pacific Microwave Conference Proceedings, APMC
Start Page
1
End Page
3
ISSN
26903946
ISBN
[9798331534554]
Date Issued
2026-02-18
Author(s)
Abstract
This paper presents the design of sub-THz and THz integrated circuits in a 40-nm CMOS process without ultra-thick metal layers. The demonstrated circuits include a 126-GHz power amplifier delivering 11.2 dBm output power, a 234.9-GHz fundamental oscillator, a 340-GHz LO source supporting full 360° phase shifting, and a 324-360-GHz phase-locked loop providing -6 dBm output power. The circuit architectures are carefully optimized, and advanced design techniques, such as transistor layout optimization, multifunctional impedance matching networks, and optimal harmonic impedance tuning, are employed to enhance performance significantly. These key building blocks are well-suited for next-generation sensing and 6G wireless communication applications.
Event(s)
2025 Asia-Pacific Microwave Conference, APMC 2025
Subjects
6G
CMOS
LO
oscillator
phase-locked loop
phased array
power amplifier
sub-THz
THz
Publisher
IEEE
Type
journal article