Ultra broad band CMOS balanced amplifiers using quadrature power splitters on glass integrated passive device (GIPD) and LTCC with flip chip interconnects for SiP integration

Journal

IEEE MTT-S International Microwave Symposium Digest

Date Issued

2012

Author(s)

Lu, H.-C.

Kuo, C.-C.

Wei, S.-A.

Huang, P.-S.

DOI

10.1109/MWSYM.2012.6259513

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/497530

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84866784341&doi=10.1109%2fMWSYM.2012.6259513&partnerID=40&md5=30f937d3ea8f0a64930d78137dcdce09

Type

conference paper