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  4. Probing the adhesion behavior of graphene via a viscoelastic stamping technique
 
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Probing the adhesion behavior of graphene via a viscoelastic stamping technique

Journal
Materials Science Forum
Journal Volume
988 MSF
Pages
11-16
Date Issued
2020
Author(s)
Suwandana R.F., Hsieh Y.-P., Hofmann M.
Mario Hofmann  
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85085184793&partnerID=40&md5=7012fb30bd955b68cab669c122dccf77
https://scholars.lib.ntu.edu.tw/handle/123456789/573718
Abstract
The assembly of graphene and other two-dimensional (2D) materials into artificial crystals termed van-der-Waals stacks has great potential to produce new materials without precedence in nature and develop novel electronic devices. To reliably assemble 2D materials into such structures, however, a better understanding of the transfer process is required. Here we report a quantitative approach to examining the adhesion behavior during viscoelastic stamping of 2D materials. By measuring the adhesion of graphene to different carrier substrates and varying the peeling speed we have identified the range of adhesion of samples. The result shows that the adhesion occurs between graphene-graphene and graphene-SiO2 substrate have a higher value than the ability of polydimethylsiloxane (PDMS) stamp to pick up. The impact of surface modification and alternative substrates is investigated and our results provide guidelines to realize an effective fabrication method for two-dimensional heterostructure devices. ? 2020 Trans Tech Publications Ltd, Switzerland.
Subjects
Adhesion; Polydimethylsiloxane; Silica; Silicones; Stamping; Substrates; Van der Waals forces; Viscoelasticity; Adhesion behaviors; Alternative substrates; Fabrication method; Heterostructure devices; Polydimethylsiloxane stamps; Quantitative approach; Stamping technique; Two Dimensional (2 D); Graphene
Type
conference paper

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