Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content

Journal

Journal of Electronic Materials

Journal Volume

44

Journal Issue

2

Pages

623-629

Date Issued

2014

Author(s)

Chuang, T.-H.

Lin, H.-J.

Wang, H.-C.

Chuang, C.-H.

Tsai, C.-H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-014-3558-7

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491973

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84920858578&doi=10.1007%2fs11664-014-3558-7&partnerID=40&md5=d6df4dbba45498ac93d6133978ffbcc0

Type

journal article