Simulation and optimization of MCM interconnections
Resource
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 7th International Conference on
Journal
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 7th International Conference on
Pages
-
Date Issued
1998-04
Date
1998-04
Author(s)
Feng, Wu-shiung
Tenqchen, Shing
Cheng, Ming-chi
DOI
N/A
Abstract
In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections.
Type
journal article
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