Simulation and optimization of MCM interconnections

Resource

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 7th International Conference on

Journal

Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 7th International Conference on

Pages

-

Date Issued

1998-04

Date

1998-04

Author(s)

Feng, Wu-shiung

Tenqchen, Shing

Cheng, Ming-chi

DOI

DOI

N/A

URI

Type

journal article

File(s)

Name

00670776.pdf

Size

485.32 KB

Format

Adobe PDF

Checksum

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